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Showing posts from February, 2026

SEMIXICON TiN-Coated Wafer Chuck

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  SEMIXICON TiN-Coated Wafer Chuck High-Durability, Low-Friction Chuck Solution for Semiconductor Processing SEMIXICON’s TiN (Titanium Nitride) coated wafer chuck is engineered to enhance wear resistance, reduce particle generation, and extend service life in demanding semiconductor manufacturing environments. The TiN coating provides a hard, chemically inert surface ideal for wafer handling, grinding, polishing, and high-temperature processes. Key Advantages Increased Hardness & Wear Resistance TiN coating significantly improves surface hardness, reducing wear and maintaining chuck flatness over extended use. Low Friction / Enhanced Lubricity Reduced coefficient of friction minimizes wafer slip, scratches, and handling damage during processing. Extended Tool Life Superior wear and abrasion resistance lowers maintenance frequency and total cost of ownership. High-Temperature Stability Maintains mechanical and chemical stability at elevated process temperatures. Corrosion Re...

SEMIXICON: High-Stability Ceramic Panels for Panel Level Packaging & Advanced Processes

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  SEMIXICON: High-Stability Ceramic Panels for Panel Level Packaging & Advanced Processes SEMIXICON engineers precision large-formAT ceramic panels and substrates critical for Panel Level Packaging (PLP), fan-out wafer-level packaging (FOWLP), and other advanced semiconductor applications. Our ultra-high flatness alumina (Al2O3) and aluminum nitride (AlN) ceramic panels are designed to meet the stringent demands of next-generation equipment, providing exceptional dimensional stability, thermal management, and minimal warpage under process conditions. *** Standard Panel Sizes & Customization: We offer a range of standard sizes to accelerate your time-to-market, with full custom manufacturing capabilities for unique tooling requirements. 310 mm × 310 mm 510 mm × 515 mm 600 mm × 600 mm 1064 mm × 991 mm 1064 mm × 701 mm Custom sizes, thicknesses, and material grades available. *** Key Engineering Specifications & Applications: Superio...

Engineering Precision in Ultra-Pure Silicon Components | SEMIXICON

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         Engineering Precision in Ultra-Pure Silicon Components | SEMIXICON At SEMIXICON, we engineer the foundation of advanced semiconductor manufacturing — Ultra-High-Purity Silicon Components. For fabs running 200mm and 300mm wafer processes, our precision materials are critical to achieving superior yield, uniformity, and device performance. Our Specialties 1. Semiconductor-Grade Polycrystalline Silicon Feedstock The base material for all critical silicon components. Purity: >99.9999% (6N+) to meet stringent contamination control requirements. Resistivity: >1,000 Ω·cm — ensures minimal dopant interference for epitaxial and crystal growth applications. 2. High-Density Silicon Sputtering Targets Designed for uniform thin-film deposition and minimal particle generation in advanced PVD systems. Purity: Maintains 6N+ base purity. Density: >99.5% of theoretical, reducing arcing and nodule formation. Particle Performance: <0.05 particles/cm² (>0....