SEMIXICON – Porous Ceramic Vacuum Chuck for Panel-Level Packaging (PLP)
SEMIXICON – Porous Ceramic Vacuum Chuck for Panel-Level Packaging (PLP) System-Level Panel Stability Solution for Lithography, Bonding, and Metrology The SEMIXICON PLP Porous Ceramic Vacuum Chuck is engineered to address one of the most critical challenges in panel-level packaging (PLP): maintaining panel flatness and dimensional stability at scale. Designed for lithography, inspection, and bonding tools, this chuck enables front-end-level process precision on large and ultra-large panels. Design Philosophy To deliver uniform, high-fidelity clamping across the entire panel substrate—minimizing distortion, stress, and warpage—while meeting the precision requirements of advanced semiconductor packaging. SEMIXICON vacuum chucks are fully customizable and designed to integrate with major OEM exposure, bonding, and metrology platforms. Key Specifications Custom Maximum Format: Up to 3000 × 3000 mm Material: Porous ceramic (Alumina / Zirconia composite) Surface Flatness (TIR): ≤ 5.0 µm...