SEMIXICON – Porous Ceramic Vacuum Chuck for Panel-Level Packaging (PLP)

 SEMIXICON – Porous Ceramic Vacuum Chuck for Panel-Level Packaging (PLP)

System-Level Panel Stability Solution for Lithography, Bonding, and Metrology

The SEMIXICON PLP Porous Ceramic Vacuum Chuck is engineered to address one of the most critical challenges in panel-level packaging (PLP): maintaining panel flatness and dimensional stability at scale. Designed for lithography, inspection, and bonding tools, this chuck enables front-end-level process precision on large and ultra-large panels.

Design Philosophy

To deliver uniform, high-fidelity clamping across the entire panel substrate—minimizing distortion, stress, and warpage—while meeting the precision requirements of advanced semiconductor packaging.

SEMIXICON vacuum chucks are fully customizable and designed to integrate with major OEM exposure, bonding, and metrology platforms.

Key Specifications

Custom Maximum Format: Up to 3000 × 3000 mm

Material: Porous ceramic (Alumina / Zirconia composite)

Surface Flatness (TIR): ≤ 5.0 µm (full area)

Thermal Stability: Up to 300 °C

Applications

SEMIXICON PLP vacuum chucks are deployed at critical process steps where panel stability is non-negotiable:

Lithography: Laser Direct Imaging (LDI), mask-based steppers, fine-line RDL

Precision Bonding: Thermo-compression bonding, mass reflow, hybrid bonding

Advanced Metrology: High-resolution inspection and surface profiling

Singulation: Panel support for dicing and laser ablation

Enabling the PLP Manufacturing Shift

The transition to Panel-Level Packaging is not just a change in substrate size—it represents a fundamental shift in manufacturing physics. Controlling warpage, stress, and precision at scale is the primary barrier to yield.

SEMIXICON porous ceramic vacuum chucks provide the foundational stability and planarity required to make PLP a high-yield, production-ready reality.

Contact SEMIXICON

🌐 www.semixicon.com 📧 sales@semixicon.com

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