Back Grinding Wheels by SEMIXICON.

Back Grinding Wheels by SEMIXICON.

SEMIXICON's back grinding wheels are engineered for the thinning and fine grinding of silicon wafers. These products offer superior grinding performance and cost efficiency.

Applications:

Back Thinning

Rough Grinding

Fine Grinding

Workpieces Processed:

Silicon Wafers: Discrete devices, ICs, and virgin materials.

Material Types: Monocrystalline silicon and other semiconductor materials.

For more information, visit www.semixicon.com.


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