Back Grinding Wheels by SEMIXICON

Back Grinding Wheels by SEMIXICON

SEMIXICON's back grinding wheels are specifically engineered for the thinning and fine grinding of silicon wafers. These wheels deliver exceptional grinding performance and cost efficiency.

Applications:

Back Thinning

Rough Grinding

Fine Grinding

Workpieces Processed:

Silicon Wafers: Discrete devices, ICs, and virgin materials

Material Types: Monocrystalline silicon and other semiconductor materials

For more information, visit www.semixicon.com.

www.semixicon.com

sales@semixicon.com


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