SEMIXICON Wafer-Handling Robot End Effector

SEMIXICON Wafer-Handling Robot End Effector

SEMIXICON supplies high-precision end effectors designed for wafer-handling robots, ensuring secure and reliable semiconductor wafer manipulation in manufacturing environments.

1. Compatibility

Wafer Sizes: Supports wafers up to 300mm in diameter.

2. Holding Mechanism

Method: Vacuum suction, passive edge gripping, or Bernoulli principle-based mechanisms.

Vacuum Requirements: Operates at a vacuum pressure of -53kPa or more.

3. Materials

Construction: Made from Carbon Fiber Reinforced Polymer (CFRP), aluminum, or ceramics for high strength and lightweight performance.

Coating: Features a smooth, abrasion-resistant Chemical Vapor Deposition (CVD) silicon carbide (SiC) coating for enhanced durability and thermal stability.

4. Dimensions & Weight

Thickness: Standard 2mm (custom specifications available).

Weight: Lightweight design to minimize robotic arm load.

5. Performance

Repeatability: Positioning accuracy of ±0.1mm.

Payload Capacity: Supports up to 4kg, including wafer and end effector weight.

6. Environmental Conditions

Cleanliness: Complies with ISO Class 2 standards at the wafer transfer level when exhausting the driving part.

7. Mounting Specifications

Mounting Interface: Standardized mounting holes and bolt patterns for seamless integration with various robot arms.

8. Options & Customization

End-Effector Types: Available in I-shape or Y-shape configurations.

Additional Features: Options for thin wafer handling, edge grip mechanisms, and customized designs tailored to specific wafer sizes and process requirements.

This specification ensures high precision, reliability, and compliance with industry standards for semiconductor wafer handling.

For more details, please visit www.semixicon.com or contact sales@semixicon.com.

This version improves flow, consistency, and readability while maintaining all technical details. Let me know if you need any refinements!


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#robotarm

#waferhandlingrobots

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