SEMIXICON-Performance Thermal Chucks for Semiconductor & Wafer Bonding Applications
SEMIXICON-Performance Thermal Chucks for Semiconductor & Wafer Bonding Applications
SEMIXICON supplies advanced Aluminum Nitride (AlN) ceramic heating units engineered for ultra-precise wafer bonding (homoepitaxial & heteroepitaxial) and demanding semiconductor processes. Our AlN heaters deliver exceptional thermal uniformity, electrical insulation, and mechanical durability for critical fabrication environments.
Key Specifications & Properties
✔ Material Composition
Base Material: High-purity Aluminum Nitride (AlN) ceramic (>99% purity)
✔ Thermal Performance
Thermal Conductivity: 170–230 W/m·K (ensures rapid, uniform heat distribution)
Coefficient of Thermal Expansion (CTE): ~4.6 × 10⁻⁶/K (matches silicon, minimizing thermal stress)
✔ Surface & Mechanical Properties
Surface Roughness (Ra): ≤ 0.03 µm (ultra-smooth for flawless wafer bonding)
Flexural Strength: ~382.70 MPa (high durability under thermal cycling)
✔ Electrical Properties
Dielectric Constant: ~8.5 @ 1 MHz (superior electrical insulation)
✔ Design & Compatibility
Wafer Sizes: Supports 200mm, 300mm, and 450mm wafers
Power Range: Operates at 100–200V, 15–50A (adaptable to process needs)
Applications
✅ Wafer Bonding – Ideal for homoepitaxial & heteroepitaxial bonding with uniform heat distribution
✅ Semiconductor Manufacturing – Critical for CVD, annealing, and lithography requiring precision temperature control
✅ Advanced Packaging – Ensures low thermal stress in 3D IC and MEMS fabrication
Why Choose SEMIXICON AlN Heaters?
✔ Superior Thermal Conductivity – Faster heat transfer, reduced energy waste
✔ Silicon-Matched CTE – Prevents wafer warping & cracking
✔ Ultra-Smooth Surface – Enhances bond integrity & yield
✔ Custom Solutions – Tailored sizes, power ratings & configurations
Contact Us Today for Your Wafer Bonding Needs!
🌐 Learn more: www.semixicon.com
✉ Email: sales@semixicon.com
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