SEMIXICON – Precision Silicon Carbide (SiC) Thinning Wheels for Semiconductor Wafer Back-Grinding & Finishing

 SEMIXICON – Precision Silicon Carbide (SiC) Thinning Wheels for Semiconductor Wafer Back-Grinding & Finishing

SEMIXICON is a U.S.-based manufacturer specializing in high-precision Silicon Carbide (SiC) grinding and thinning wheels engineered for semiconductor wafer back-grinding, planarization, debonding, and finishing operations.

Our SiC wheels are optimized for silicon (Si), gallium arsenide (GaAs), sapphire, SiC, and compound semiconductor wafers, delivering superior flatness, uniformity, and surface integrity required for advanced logic, memory, RF, and power device fabrication.

⚙️ Key Engineering Features & Technical Specifications

Abrasive Grain: Green Silicon Carbide (GC) – ultra-hard, sharp cutting edges ideal for grinding hard, brittle substrates including Si, GaAs, GaN, SiC, and sapphire.

Bond Type: Vitrified (Ceramic) Bond – porous microstructure ensures stable cutting, high coolant permeability, and excellent chip evacuation.

Wheel Structure: Porous, open-pore design improves heat dissipation, prevents loading, and extends usable wheel life.

Grit Size: #200 – #2000 (customizable for removal rate, surface roughness, and wafer strength requirements).

Diameter: 100 mm – 500 mm

Bore Options: 32 mm, 76.2 mm, 127 mm (custom bores available).

Thickness: 5 mm – 20 mm

Hardness Grade: K–N (optimized balance between wear resistance and self-sharpening for consistent grinding).

Coolant Compatibility: Supports water-based and semiconductor-grade coolants for thermal stability and improved finish.

Operating Guidance: Use within rated maximum grinding speed for precision and safety.

🚀 Performance Advantages

Achieves excellent wafer flatness, parallelism, and total thickness variation (TTV) for precise back-thinning.

High thermal conductivity supports stable grinding of thin and ultra-thin wafers.

Reduces microcracks, surface damage, and wafer breakage risk during thinning.

Long tool life with consistent removal rate under high-load grinding conditions.

Ideal for CMP pre-processing, wafer thinning, MEMS fabrication, debonding processes, and ultra-thin wafer finishing.

Compatible with major wafer grinding platforms used in advanced semiconductor manufacturing.

🌐 Contact SEMIXICON

Website: www.semixicon.com

Email: sales@semixicon.com

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