SEMIXICON delivers precision-engineered vacuum chuck pick-up pads / robot pads

   SEMIXICON delivers precision-engineered vacuum chuck pick-up pads / robot pads for DISCO DDS 2300 series wafer handling systems. Designed for semiconductor wafer pick-up and transfer, these pads provide stable vacuum adhesion, low particle generation, and damage-free handling of thin and fragile wafers.

Learn more at www.semixicon.com or contact sales@semixicon.com

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