SEMIXICON-Performance Thermal Chucks for Semiconductor & Wafer Bonding Applications
SEMIXICON-Performance Thermal Chucks for Semiconductor & Wafer Bonding Applications SEMIXICON supplies advanced Aluminum Nitride (AlN) ceramic heating units engineered for ultra-precise wafer bonding (homoepitaxial & heteroepitaxial) and demanding semiconductor processes. Our AlN heaters deliver exceptional thermal uniformity, electrical insulation, and mechanical durability for critical fabrication environments. Key Specifications & Properties ✔ Material Composition Base Material: High-purity Aluminum Nitride (AlN) ceramic (>99% purity) ✔ Thermal Performance Thermal Conductivity: 170–230 W/m·K (ensures rapid, uniform heat distribution) Coefficient of Thermal Expansion (CTE): ~4.6 × 10⁻⁶/K (matches silicon, minimizing thermal stress) ✔ Surface & Mechanical Properties Surface Roughness (Ra): ≤ 0.03 µm (ultra-smooth for flawless wafer bonding) Flexural Strength: ~382.70 MPa (high d...